The electronics group of Henkel has introduced a new process, Accelerated Cooling (AC), to be used with its two flip-chip in package non-conductive paste (NCP) underfill encapsulants. The NCP materials, Hysol FP5000 and Hysol FP5001, provide moisture resistance, thermal cycling resistance, expedite the assembly process and are designed for Pb-free interconnects.
 
Provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, eliminating the need for flux application, reflow and cleaning. 
 
AC process heats the device while it is secured by the flip-chip bonder head and then is rapidly cooled during compression onto the NCP-coated substrate. This rapid cooling enables assembly completion prior to any excess heat exposure and, consequently, reduces package warpage, voids caused by moisture and assembly cycle time. Cuts typical cycle time in half (cycle times average 7 sec.).
 
Henkel, electronics.henkel.com

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