Palomar Presents Model 3500 III Automatic Die Bonder
Published: 27 July 2006
by Staff
Capable of automated eutectic die attach using backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets. Pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.
Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the sub-micron axis resolution yields placement repeatability of better than ±12 micron (0.5 mil), 3 sigma with fluids, ±5 micron (0.2 mil), 3 sigma with pulse heat eutectic applications.
Placement of the die in relation to a previously placed die can also be tightly controlled through custom automation algorithms.
Machine base is a honeycomb core optical table that provides vibration damping and thermal settling response. Large work area. Cantilever design permits unobstructed, open access on three sides for set-up. Soft touchdown or non-contact laser height sensing mechanisms assist in pickup and placement of fragile devices. Eight-position turret head can rapidly change tools on the fly without a tool dock assembly. Constructed from an optical breadboard where parts can be bolted down in a myriad of configurations, so any form of presentation such as expanded wafers, waffle or gel packs, tubes, or tape and reel may be used and options for up to three dispensers, hot rails, heat cure stations, hot gas, UV fluid curing systems, and more can be incorporated.
Has infrared light curtain around the open perimeter of the assembly cell. This sends an infrared signature down each inch of the perimeter so that it cannot be fooled by background thermal radiation. When the system is in operation and the safety curtain is violated, the system immediately (within ~ 3 millisec.) shorts the inputs to the digital servo driven motors, stopping all motion.
Uses Windows XP.
Palomar Technologies, www.palomartechnologies.com
