EFD, Leister Tech. Develop Laser Soldering Reflow System
Published: 11 August 2006
by Staff
The Solder Paste Group of EFD and Leister Technologies will jointly market an automated tabletop solder paste reflow system.
The soldering system combines EFD’s auger valve and Ultra TT tabletop dispensing robot with Leister’s Novolas diode laser. Uses EFD’s SolderPlus solder paste. The solder paste formulations available are fast, clog-free and designed to support the sub-second reflow cycles times common with laser heating.
The package system includes SolderPlus paste, the Ultra TT robot, EFD ProcessMate 6500 temperature control system and the diode laser, all housed in a laser-safe certified cabinet. These system components can also be bought individually.
EFD and Leister have aimed the marketing of their system at users requiring discreet, precise, rapid heating and controlled non-spatter high-yield solder performance.
The package is ideal for processes requiring non-contact point-to-point soldering of temperature-sensitive parts, especially component manufacturers serving the automotive and medical industries. Heat damage to temperature-sensitive plastics is said to be eliminated with the system.
www.efdsolder.com or www.leisterlaser.com
