CyberOptics Corp. will highlight SE 300 Ultra, its 3-D solder paste inspection system, in booth 2D21 at the upcoming NEPCON South China exhibition and conference in Shenzhen.
 
The 100% inspection system reportedly provides accurate, repeatable results at speeds that keep up with increasing line cycle times. Incorporates the field-proven technology and reliable features of the SE 300 along with new features.
 
Features a conveyor that accommodates panel sizes from 101 x 35 mm (4 x 1.4") to 508 x 508 mm (20 x 20"), flexible conveyor rail options — rear or front-fixed rail, program call-up using a bar code reader, and the ability to read skip marks and exclude data from inspection results.
 
Can handle odd-shaped pads, has paste height accuracy (each measurement calculated using 200k reference points) and an XML file format output for easy integration to shop floor control systems. Features paste height, area and volume measurements with Gage R&R <10%.
 
New features include 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits , easy-to-use Operator Interface and Defect Review and conveyor auto-width adjustment.
 

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