Hysol FP5110 is specially formulated for flip-chip image sensor modules and is said to provide adhesion to both 2- and 3-layer flexible printed circuits by bonding to both polyimide and epoxy adhesive material.
 
Bonds bumps to substrates by means of a Pb-free-compatible thermal compression process. Compatible with thermal compression and ultrasonic bonding processes; low temperature 10-sec. SnapCure at 180°C; storage requirement of -15°C.
 

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