Samsung’s RF30 series reflow soldering systems has been added to the SP450V screen printer, SM and CP Series component placement systems, and associated board handling systems, to provide a full turnkey line.
  
Features include a Windows-based operator interface, a multifunctional heating system. Double-covered insulated heating zone construction is said to feature multi-ejection nozzles and fans circulating air in five directions. Dual-active cooling zones with variable speed fans reportedly bring the board temperature below the liquid state at a controlled rate. Available in 8, 10 and 12 heated zones, plus two cooling-zone configurations.

Dynatech Technology, www.dynatechsmt.com

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