Multicore LF600 is a halide-free, no-clean Pb-free solder paste formulated for humidity resistance and said to be ideal for varying manufacturing climates. Permits printing and reflow performance in temperatures up to 86°F with 80% relative humidity. Has been designed with a gelling component that enables zero hot slump. Delivers an open time of 24 hrs. and an abandon time of 4 hrs. Is available for stencil printing 0.4mm pitch QFP and 0.4mm CSP devices and can be used with surface finishes such as NiAu, immersion Sn, immersion Ag and OSP copper.
Henkel Corp., www.henkel.com/electronics
