The MT-300 Pb-free dual wave solder system is available for low- to mid-volume, defect-free soldering of high-density boards populated with through-hole, surface-mount, or mixed technology components. Small footprint (8' long); uses dual transducer-controlled motors for uniform wave heights; features an adjustable titanium finger conveyor with a max. board width of 11.75". Automatic finger cleaner is standard, as are titanium-alloy solder pot, wave nozzles, and heavy-duty pumping system. Pot capacity of less than 500 lbs.