EA-6800 microelectronic adhesives for flip-chip semiconductor packages are said to offer two-fold improvement in cure rate; EA- 6900 is specifically formulated for the high temperatures that Pb-free assemblies must endure during rework. Are RoHS compliant. Cure in about 15 min., reportedly with no loss of performance. Come in production quantities. Feature reduced voiding from residual moisture within substrates and maintain a low modulus.
