Wedge emulation technology is for low profile interconnects, fine pitch, running stitch interconnects, and die-to-die bonding in high-density packages such as LEDs and RF packages. Uses Model 8000 ball bonder. Said to bond seven to 12 wires per second. Can program an interconnect beginning with a stitch instead of ball; complies with visual standards defined per Mil-Std-883, Method 2017. Can use a wire other than gold, such as aluminum or copper.

Palomar Technologies, www.palomartechnologies.com