Die sorter CS 1250 is said to use the latest technologies for robotic motion control and vision inspection. Pick-and-flip mechanisms are said to transfer die to tape reel at more than 16,000 parts per hour. Robotic head design permits post-flip inspection of the active surface of the die. Said to ensure quality of the part before placement. Parts are fully inspected before picking and placement to the tape pocket. Further inspected for mechanical quality, laser ID, and position in the tape pocket after placed. Any part that fails is automatically removed to a reject bin. A post tape seal inspection is performed. Uses single touch monitor screen. Features include 4-point vision inspection, real-time wafer map status, automatic calibration and auto tape load. Standard system handles 300 mm wafers.

Datacon Technology, www.datacon.at