The updated cold bump pull for 4000HS High-Speed Bondtester reportedly offers symmetrical and almost pure tensile load. Less deformation. Loading is said to mimic that of drop testing on corner balls. Digital data capture from high bandwidth transducers reportedly eliminates subjective evaluation. Is suitable for detecting brittle fracture failures and can be used to evaluate different alloys, the influence of various pad finishes and the effects of aging on solder joint reliability. Said to ensure full compliance with new JEDEC standards.

Dage Precision Industries, www.dage-group.com