Vigon N 501 pH-neutral defluxing cleaning agent ensures compatibility with sensitive SMT production materials such as aluminum, copper, brass, nickel, plastics and label materials. Is a water-based, non-flammable MPC (micro phase cleaner) specifically developed for spray-in-air processes. Has short contact times and bath concentration levels as low as 10 – 15%.
Zestron, www.zestron.com
The Yamaha YS24 pick-and-place machine is a dual-sided machine with a total of 120 feeder positions in a space of 2 m2. Has speed up to 72,000 components per hr. Performs placement of components ranging from 0.4 mm by 0.2 mm (01005) up to 32 sq. mm. Handles board sizes up to 700 mm long by 460 mm wide. Includes NPI features like virtual sticky tape, easy editors and setup assistant.
Assembléon, www.assembleon.com
RemUVa is designed to remove coatings from finished assemblies. Has a fully configurable nozzle to permit working on smaller areas or to remove coating across a larger area. Reportedly does not damage adjacent devices, interconnects or PCBs. Is a bench-top powder abrasion system designed to remove conformal coatings, including UV40. Is equipped with adjustable powder flow control and air pressure regulation. Uses an abrasive media known as carbo-blast. Uses a point ionizer to reduce ESD from reaching levels that could potentially damage components.
HumiSeal, www.humiseal.com
Camalot SmartStream non-contact dispense pumps now come with optional Dual Head Synchronous Mode. Synchronous dispense mode said to improve throughput by 50% while eliminating risk of poor yields/scrapped product experienced by alternative approaches to simultaneous dispensing on multi-up circuits. Is capable of detecting panel rotation and will automatically switch to an asynchronous dispense mode to ensure that both heads dispense accurately on the PCBs within the skewed panel. New software algorithms ensure dual pumps are pitched correctly and have identical flow rates. Is compatible with the Camalot XyflexPro+ and FX-D dispense systems and may be retrofitted in the field.
Speedline Technologies, www.speedlinetech.com
A thick film dielectric and conductor system improves the mounting of silicon ICs to aluminum substrates. Provides low thermal resistance between the chip and heat sink in applications such as HB LEDs. The glass system of the Pb- and Cd-free dielectric paste was developed to offer thermal conductivity on both 3003- and 6061-grade alloy aluminum substrates. Reduces bowing by closely matching the CTE of aluminum. Also, a Pb-free silver conductor paste, fired together at 550°C with the dielectric paste, provides solderability and adhesion. Is for applications such as direct-mounted LEDs.
Heraeus Thick Films Materials Business Unit, www.heraeus.com
XT V 130 x-ray inspection system is compact and comes with a 30-130 kV open micro-focus x-ray source, 4-axis programmable manipulator and 16-bit imaging system based on a 4” image intensifier. Reports compliant with MRP systems. Focal spot size down to 3 microns, 320X geometric magnification and tilt angle up to 60°. Rotate stage and CT capability optional. Hinged door provides access to inspection area, which fits samples up to 40 x 35 cm (16 x 14”).
Nikon Metrology, www.nikonmetrology.com
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