istorage automatic modular cabinet manages SMD reels from 7 to 15, QFP/BGA trays, PTH components, PCBs, and other parts. Can handle up to 5,500 reels. Permits multiple pick of part racks. Is bar-code driven, and calculates component quantities for single or multiple orders. Includes “count down” management for MSDs.
i-tronik, www.itronik.com
SN100C P600 D4 is a halogen-free, no-clean, Pb-free solder paste that contains no fluorine, chlorine, bromine or iodine. Is said to be high reliability, for high-density assembly with stable printability; reflows easily with good wetting and minimum incidence of mid-chip balling, and low residue. Can be reflowed with profiles similar to SAC 305 and SAC 405 with 240°C peak.
Nihon Superior, www.nihonsuperior.co.jp/english/
Aquanox A4703 neutral pH aqueous cleaning chemistry reportedly is effective with concentrations as low as 3%. For use in spray batch and spray inline cleaners to remove OA, no-clean and RMA pastes and fluxes, including Pb-free residues. Is controlled by refractive index, both manually and when using an automated process control system. Completely water soluble, and operates at <~63°C. Has a flashpoint of 104°C and a boiling point of 138°C. Comes in 5, 25 and 200 l containers.
Kyzen, www.kyzen.com
Cobar, www.cobar.com
i-SAC105 has silver composition of 0.5-1.5%, and contains cobalt for bright, shiny solder joints and fine grain microstructure, and germanium. Has a melting point of 217° to 227°C and a specific gravity of 7.4 g/cm3.
Balver-Zinn, www.balverzinn.com
is for Is noncontact and reportedly does not affect conductors or components near the cutting channel. System software imports data directly from popular layout programs. Handles boards up to 229 x 305 mm (9” x 12”). Integrated vacuum table holds boards securely in position, with no need for further clamping devices; an advantage over conventional laser separation techniques for thin and flexible substrates.
LPKF, www.lpkf.com
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