Cyberoptics Unveils QX500 AOI, Upgrades SE500-X Solder Paste Inspection
Published: 04 January 2010
by Mike Buetow
QX500 AOI has improved cycle times. Now includes SIM, enabling on-the-fly inspection.
SE500-X 3-D solder paste inspection now accommodates boards/panels measuring 100 x 100 mm up to 810 x 610 mm. SE500 and SE500-X 3-D can inspect pad sizes down to 01005.
CyberOptics Corp., www.cyberoptics.com
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