XT-3 semiautomated x-ray inspection offers transmission and optional oblique viewing. Is programmable without CAD data. Offers traceable inspection process with an optional barcode reader that also serves to automatically recall and load the inspection program. Designed to address intuitive operation, low-volume production, and failure analysis for SMT production inspection and quality control protocols. Includes image processing software. Tests and measures to IPC specifications, BGA, QFN, FET voiding, as well as barrel fill on connectors.

Matrix-FocalSpot, www.matrix-focalspot.com

PSV7000 automatically programs up to 2000 devices/hour with tray, tape or tube input. Is capable of handling devices as small as 1.5 x 1.5mm. Cuts changeover times up to 75%. Options include laser marking, 3D co-planarity, serialization and traceability software. Can have up to 96 individual programming sockets installed and supports all device types, including FPGAs, CPLDs, microcontrollers, and flash memories (including eMMC, NAND and NOR devices). 

Data I/O, www.dataio.com/PSV7000

Zestron Eye monitors wash bath concentration in the presence of flux loading. Consists of sensor and digital controller that displays concentration in real time. Fully integrates with commonly used cleaning machine types by leading manufacturers. For use with Zestron cleaning agents.

Zestron, www.zestron.com

Tags: Zestron, PCB cleaning, flux, wash bath monitor

Model S1 mkII solder paste inspection system performs high-speed 5D inspection (simultaneous 2D and 3D inspection). Re-engineered inspection head has improved 2D image capture. Patented sensor technology simultaneously combines 2D and 3D image processing, reducing inspection tolerances. True area, shape, volume, offset and height measurements provided in combination, for process control.

MEK Europe, www.mek-europe.com

TAGS: MEK, solder paste inspection, AOI, printing, SPI, SMT