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SpectorBOX bottom-up modular AOI is for inspection of wave and selective soldered plated through-hole and SMT components. Inspects PCBs inside solder frames directly from the conveyor system. Can be equipped with nine cameras, including an optional Z-axis moveable head. XY drive gantry with ball screw mechanics delivers high-speed inspection. 100% simultaneous inspection can be accomplished with two platform modules combined for bottom and top sides. Accommodates board sizes up to 550 x 520mm.

MEK Europe, www.mek-europe.com

3800-MK2 automated programming system combines universal programming technology, 8th gen., with a fine-pitch handling system. Reportedly is capable of processing programmable devices from the largest QFP to the smallest WLBGA. Includes vision and pneumatic systems that provide VSP support. Provides accuracy and repeatability for packages as small as 1mm x 0.5mm. Can simultaneously support tape, tray, tube and marking.

BPM Microsystems, www.bpmmicro.com

5860 multi-strategy test system combines analogue in-circuit test and functional test capabilities. Combines panel and larger cabinet space for additional instrumentation. When coupled with inline fixture, it provides automated production test solution. Is SMEMA-compliant.

Aeroflex Holding Corp., www.aeroflex.com

Multi-Site configurations of TestStation in-circuit test system are available. Support parallel test of two or more boards. Are available for automated inline and manual offline use. Feature zero-footprint test head that fits within existing handler enclosure. Deliver parallel testing for 6-wire performance analog and digital in-circuit test, functional test, boundary scan, flash programming and parametric test options.

Teradyne, www.teradyne.com

Nanofics 110 and Nanofics 120 nanocoatings for conformal coating electronics devices are said to be highly water repellent (water contact angles of 110 and 120 degrees, respectively, according to ASTM D5964) and highly oil repellent (oil repellency levels of 6 and 8, respectively, according to ISO 14419). Are fluoropolymer type coatings, and are deposited by low pressure plasma technology. Are PFOA and PFOS-free. May be applied to components or PCBs, and protect against corrosion from sweat or salt mist. Can be applied to rigid or flexible substrates.

Europlasma, www.europlasma.be

 

Loctite TAF thermal absorbent films reportedly lower CPU and skin temperature of handheld devices by more than 3°C. Can absorb, spread, insulate and dissipate thermal energy generated by ICs. Create airflow route through which hot air can move out of device. Regulate heat and management of CPU temperature rise and fall. Are available in customized, pre-cut sizes and thicknesses. Film thickness and layer constructions can be adapted to create thinner or thicker solutions with multi-axis contourability.

Henkel, www.henkel.com/electronics

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