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New Products

High density plus (HD+) card edge power connectors reportedly deliver the highest current density of any card edge power connectors.

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Surface Analyst XA evaluates material surfaces to reduce waste, rework, and recalls when poorly prepared substrate surfaces lead to bonding, coating, sealing, painting or printing failure.

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Master Bond EP17HTND-CCM is a single-component epoxy that is not premixed and frozen.

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Niton XL5 handheld X-ray fluorescence (XRF) analyzer includes three new calibration modes and additional functionality designed to ease screening of products for hazardous materials.

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Rotating Brush Nodule for cleaning printed circuit boards comes in MBK modular construction kit and includes a round brush driven at a fixed speed by a DC motor.

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Low-void solder columns have high temperature core and are structurally stronger and more reliable than ones with a higher incidence of voids.

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