HSI1x instrument for Diamondx platform features 32 transmit lanes and 24 receive lanes with up to 12.8 Gbps data rate.

Loctite Ablestik ABP 8068T die attach materials facilitate package-level sintering and address regulatory challenges of high-lead solders, thermal conductivity drawbacks of conventional die attach pastes, and processability shortcomings of traditional sintering products.

SP1220 screen printer is designed to accommodate mid-sized long boards up to 48" in length.

6892 series connectors feature 0.5mm-pitch flexible printed circuit (FPC) and flat flexible cable (FFC) with improved quality assurance checks.