Master Bond EP110F8-3 is a two-part epoxy for sealing, encapsulating, potting, and casting applications.

CA-188-1 low-temperature cure electrically conductive adhesive is for die attach and general circuit assembly applications.

S3088 SPI for solder paste inspection and S3088 ultra and S3088 ultra gold AOI now come in extended versions for long printed circuit boards, including LED boards, with lengths up to 2000mm.

MT2168 XT pick-and-place handler has two new optional features that target optimization of test floor processes: double device detection (DDD) increases binning integrity; automatic temperature calibration helps calibrate as scheduled without manual processes.