New Products
MK7 SMT reflow oven incorporates lower delta T, reduced nitrogen consumption and extended PM.
TF Series BGA rework systems include TF1800, designed for standard board sizes of up to 12" x 12", and TF2800 for large, high-mass PCBs up to 24" x 24".
Smart Reflow Analyzer (SRA) is an integrated fixture and profiler designed to collect reflow oven-related data to analyze and track machine stability from run to run over time.
Heatwave software is a pictorial representation of an assembly that is updated in real-time as failures are reported to the manufacturing execution system.
G Series XRF is for analysis of precious metals, tin and nickel on PCBs, wafers, connectors and other electronic components.
Press Releases
- Scanfil and Etteplan deepen their strategic partnership into production testing
- NOTE receives order worth 132 MSEK and expands collaboration with customer within Security & Defence
- Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
- ZTEST Electronics Inc. Announces Transition to the OTCID Market