New Products
TF Series BGA rework systems include TF1800, designed for standard board sizes of up to 12" x 12", and TF2800 for large, high-mass PCBs up to 24" x 24".
Smart Reflow Analyzer (SRA) is an integrated fixture and profiler designed to collect reflow oven-related data to analyze and track machine stability from run to run over time.
Heatwave software is a pictorial representation of an assembly that is updated in real-time as failures are reported to the manufacturing execution system.
G Series XRF is for analysis of precious metals, tin and nickel on PCBs, wafers, connectors and other electronic components.
Smart reflow process inspection (RPI) data analytics have been integrated into iTAC.MES.Suite.
Press Releases
- Kitov AI Inc., FANUC America partner to advance AI-driven smart manufacturing solutions
- INSPECTIS AB ‘Makes it a Meal’ with Series U50s Advanced Kit
- Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
- Libra Industries Launches In-House High-Precision Underfill Capabilities