New Products
Type AuR gold ribbon bonding wire is fabricated to 4N specifications with 99.99% purity using a dry process.
PF606-PW215 water-soluble solder paste provides high-speed printability that reportedly produces great solder paste print quality, as well as a wide reflow process window for excellent solderability.
Sarcon 15GTR is a thin thermal interface composite film made from heat-conducting silicone and a 0.05mm fiberglass reinforcement layer.
Scanflex II Cube JTAG/boundary scan controller has an optional Wireless LAN interface.
Master Bond EP21ND-LP two-part epoxy is for structural bonding applications involving large surface areas.
Press Releases
- Koh Young Honored by Foxconn with 2024 Digital Ecosystem Partner Award
- SIA Applauds Finalization of CHIPS Investments for Intel Manufacturing Projects
- Spectrum Advanced Manufacturing Technologies Named Manufacturing Partner for D-Orbit USA
- Absolute EMS Enters Strategic Partnership with PTEC Solutions to Enhance End-to-End Electronics Manufacturing Capabilities