New Products
XQuik II comes with reel handling automation for component counting combines automatic component counting system with high-speed, three-axis robot to transfer reels from an input storage buffer into x-ray counting system, and back to an output storage buffer.
Loctite GC 18 is a low-voiding solder paste designed for use with multiple component sizes and types, including large, thermally challenged devices such as MOSFETs, LPBGAs, QFNs and large array components.
Diamondx VI1x, with power and automotive instrumentation featuring SmartMux, offers measurement quality and parallel test efficiency.
SMP bullet adapters are designed for blind mate applications with a variety of board spacing and package size requirements.
TurboBoost for eMMC 5.0 and 5.1 devices on the LumenX programming enables improvement of programming performance.
Berquist Gap Pad TGP 6000ULM and 7000ULM thermal interface materials have been formulated with resin platform to deliver ultra-low modulus capabilities and thermal conductivity of 6.0W/m-K and 7.0W/m-K, respectively.
Press Releases
- Scanfil and Etteplan deepen their strategic partnership into production testing
- NOTE receives order worth 132 MSEK and expands collaboration with customer within Security & Defence
- Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
- ZTEST Electronics Inc. Announces Transition to the OTCID Market