Master Bond EP93AOFR two-part epoxy may be used for encapsulation and potting, bonding, sealing and coating.
ThermoActive Suite Plus software allows operators to use keyboard functions to execute in-process features such as thermal boost, extended soak, skip zone, and temperature averaging.
ULT 200.1 is for removal of laser and soldering fumes, dusts, gases, odors and vapors.