Master Bond EP21ND-LP two-part epoxy is for structural bonding applications involving large surface areas.

SpiCAT simulation software includes SpiMLCC and SpiTAN portals that provide electrical and performance characteristics by frequency and temperature for a range of multilayer ceramic or tantalum, polymer, and niobium oxide surface-mount capacitors.

PowerSpector BTL AOI offers synchronized inspection of top and bottom sides of PCBs after placement of SMT and through-hole components and after reflow, wave or selective soldering.

FH62 compact flexible printed circuit (FPC) connector has a single-action lock designed for automatic assembly.