Master Bond EP17HTS-DA is a one-component, no-mix, electrically conductive die-attach epoxy. Is silver-filled system. Maintains Tg of 140°-150°C. Passes MIL-STD-883J thermal stability requirements at 200°C. Die shear strength is 35-40kg-f at room temp. Meets NASA low outgassing specifications. Service temp. extends from -80°F to 550°F. Has volume resistivity of less than 0.005ohm-cm and performs well as heat conductor. Is thixotropic and can be dispensed manually or via automated dispensing systems. Is not premixed and frozen and reportedly has unlimited working life at room temp. Requires heat cure of 300°F for 2 to 3 hr., followed by post-curing at 350°F for 1 to 2 hr.

Master Bond
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