3Xi-M200 3D-CT automated x-ray inspection system is designed to inspect and measure insulated gate bipolar transistor power modules.
200keV high-precision x-ray imaging and 3-D reconstruction uses planar computed tomography; provides clear images by penetrating through heat sink's multiple layers. Is equipped with detector that enables high-sensitivity imaging, while expanding field of view and updated 3D-CT reconstruction processing software. Is 1,400mm wide and weighs 5,100kg. Handles board sizes of 50 x 140mm to 360 x 330mm. For 360 x 510mm boards, two-step image capture is available.