Flying Vision Verification to SM Plus component mounters uses on-the-head, upward-looking camera systems to verify presence of multiple components simultaneously following pickup.

vVision and SI software use 3D solder joint measurement.

DF40GL series low-profile flexible printed circuit connector supports FPC applications in a small package and operates at USB 3.1 gen 2 speeds up to 10Gbps.

3D•EyeZ sensor system permits measurement of the press-in depth of press-fit connectors mounted on PCBs.