New Products
Master Bond EP110F8-5 potting, sealing, encapsulation and casting epoxy is dimensionally stable and has low shrinkage upon cure.
Alpha Sn42 Bi57.6 Ag0.4 lead-free solid solder wire is primarily for rework operations and touchup soldering of low-temperature-based electronic assemblies.
Revision F IPC-JSTD-001 training kit is used in IPC training classes for certification.
Particle Impact Dampers reduce random vibration in PCB assemblies in harsh environments.
3D Planner virtually simulates the inspection process and evaluates a range of inspection scenarios offline.
XJTAG v3.6 includes several new productivity and automation-focused enhancements, for setting up tests for complex boards in significantly less time.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing