New Products
Master Bond EP13LTE features a low coefficient of thermal expansion of 15-20 x 10-6in/in/°C.
UA-3307-B is an edgebond adhesive that enhances board level reliability in automotive and other harsh environment applications.
PF606-P245 lead-free zero halogen solder paste has continuous high-speed printability and a wide reflow process window.
Loctite Ablestik EMI 8660S and EMI 8880S conformal coating metal inks, for semiconductor package-level electromagnetic interference (EMI) shielding, may be used with spray coating equipment.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing