Vitronics Soltec's ZEVAm+ selective soldering machine has been redesigned to accommodate board sizes up to 510mm x 510mm (20in. x 20in.).

Krylex's Kura-Low electronics adhesive enables high performance bonding performance at thermal cure temperatures as low as 60◦C, all while being supplied in a highly RT stabilised, one-part, pre-mixed formula.

MRSI Systems' MRSI-705HF high force die bonder is a new variant of the MRSI-705 platform.

Stackpole’s RNCP thin film chip resistor series now features 1210, 2010, and 2512 sizes.