3D sensing capabilities incorporate multi-reflection suppression technology and 3D algorithms. Enable high-quality 3D images at production speeds, using multi-view sensors. Multi-view 3D data are merged with algorithms and MRS that suppress reflection that can distort data. Sensor design captures and transmits data simultaneously and in parallel.

CyberOptics Corp., www.cyberoptics.com

XQuik combines x-ray imaging with AccuCount Technology image processing and inventory management to provide accurate counts of components stored in tape-and-reel. Is said to automatically completes the count of components as small as 01005 with better than 99% accuracy in seconds. Works without having to remove reels from moisture barrier or anti-static bags. Benchtop system with a footprint of 26 x 24" (66 x 62cm). Barcode reading, automatic label printing and MES system interface options available.

VJ Electronix, http://vjt.com/vje/vje/

TrueHeight Spacer Blocks non-collapse disc spacers are said to improve yields of assemblies with large BGA devices. Enables reflow soldering of some types of through-hole devices. Are said to mitigate corner solder bridging caused by BGA warping during SMT reflow. Come in tape-and-reel packaging for automatic placement. Aid in intrusive reflow applications where there is either no standoff function or inadequate clearance under through-hole components by raising the component off the PCB, permitting solder to reflow freely to achieve 100% hole fill.  Height control + 0.010mm.

Alpha, www.alpha.alent.com

Bi rework solder paste is designed for desoldering Pb-free components and for LED removal. Reduces risk of board damage during desoldering. With desoldering temp. of 180°C, it reduces desoldering temperatures and times. Is a no-clean, halide-free flux. Features easy dispensing and cleanup. Provides excellent removal of through-hole and SMT components. Is RoHS compliant.

The Balver Zinn Group, www.balverzinn.com