WXsmart soldering platform consists of 2-channel soldering station and includes WXair hot-air module for in-air and vacuum requirements. WXMPS MS smart soldering iron has ergonomic pencil design that fits in operator’s hands, providing precision for small soldering applications under the microscope. Performs pico, micro and ultra soldering.

Nihon Superior's LF-C2 Lead-Free Solder Paste delivers long life in thermal cycling but with a compliance that means that it is resistant to cracking under stress typical with automotive electronics.

Uses calibrated levels of the two key strengthening tools available in solder alloy formulation, stable dispersed particles combined with solid solution strengthening of the tin matrix. With a liquidus temperature of 213°C, can be reflowed at a lower temperature than SAC305 and has a higher shear strength than SAC305. Delivers excellent performance over a wide range of component types and process parameters.

Nihon Superior

www.nihonsuperior.co.jp

Rohm Semiconductor's CSL1901 series of 0603-size (0.6in × 0.3in)/1608-size (1.6mm × 0.8mm) LEDs are optimized for low-light applications for use in indicators and numeric displays in factory automation equipment (i.e., PLCs) and communication control equipment such as modems and routers.

Reduces brightness variations by half and color sifting by 3nm under low-light conditions. Available in a lineup of five colors in 0603 size.

Rohm Semiconductor

www.rohm.com

Loctite Ablestik ICP 2120 electrically conductive adhesive cures at room temperature, improving yield rates and protecting sensitive structures within mobile device compact camera modules (CCMs).