New Products
EP2 tantalum capacitor is available with radial through-hole terminations with stud-mount option in B and C case codes.
High Speed Alignment software reportedly can increase speed of six-axis robots 70% and improve accuracy 50%.
3Di inline AOI system is for inspection of high-density printed circuit boards and boards with combinations of small and tall components.
EO-B-023 A to E series fluxes are identical to EO-FC-006 filling compound used in tubular solders.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager