New Products
Profiling Software 2G and SPS Smart Profilers now come with optional Dual Profiling, permitting up to 24 thermocouple locations in a single profile run for temperature profiling measurements.
PF918-S lead-free BGA spheres is formulated with SnAg4.0Bi3.0 alloy designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
HCSM2818 resisters are rated at 5W and now provide a 2mΩ resistance value with TCR of 100ppm.
Master Bond EP17TF one-part epoxy has paste consistency and can be dispensed evenly and uniformly.
This interactive component search tool is available as a fixed navigation menu option on the Kyocera AVX website and accessible via computer, tablet or smartphone.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager