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The Advanced Starter turnkey line is for prototyping and other low-volume assembly. Consists of a stencil printer, a full-function automatic pick-and-place system and a Pb-free conveyor reflow oven. Only options are feeders. ECM-6711S placer has on-the-fly top vision plus bottom vision, 24-lane feeder base, 13.75" x 9.8" placement area, computer and LCD monitor; is suitable for fine-pitch devices and BGAs. Stencil printer is 4500 with X, Y and theta adjustments for fine-pitch SMT printing of single or double-sided boards. Also features TN350 Pb-free forced hot air convection reflow oven with five upper and lower heat zones, each with independent PID controllers settable to 320ºC at accuracy of ±1ºC.


 
This pick-and-place system is capable of placing 3-D-MID technology. Is based on inline pick-and-place FLX2011-LCV system. Is completed by a palette transport system, a five-axis robot and a dispensing head with two valves. A free-motion robot arm is located in the chassis and grips the 3D-MID module from the transport system. Dispensing head is equipped with two individual touch-less dispensers: one for precise dispensing of solder paste, the other for accurate metering of fast-curing adhesive. Solder paste is applied to the electrical contact surfaces. Glue is dispensed on other locations to hold the SMD part until the reflow process and absorb mechanical stress. SMD components are placed with a vacuum tool and are picked from feeders, measured and aligned by an optical centering system, then placed to contact surfaces. Standard components are aligned on-the-fly with a laser system. For BGA, QFN and QFP, Cognex Vision is used.

Essemtec AG, www.essemtec.com
 
DispenseJet DJ-100 piezoelectric jets are said to be suitable for a range of fluid types and viscosities. Three models are available, each designed to dispense different types of fluid: DJ-100 Standard, DJ-100 NC for low viscosity materials, and DJ-100 GH, designed for highly viscous fluids. Novel “Jet on the Fly” technology reportedly shoots precise volumes in dots, lines and patterns. Reportedly eliminates Z-axis movement. Can achieve flow rates up to 200 mg/sec. and shot rates up to 150 dots per sec. Come with a serialized hardware set that includes a matched ball and seat. Calibrated Process Jetting uses weigh scale feedback to maintain consistent dispense volume. Achieve dot diameters as small as 200 µm.
 
Asymtek, www.asymtek.com
 
Niton XL3t is said to deliver improvements in light element detection, overall sensitivity and measurement times as much as 10 times faster than conventional Si-PIN detectors, and up to three times more precise than conventional silicon drift detectors. Permits light element detection of magnesium, aluminum, silicon, phosphorus and sulfur without helium or vacuum purging. Incorporates 80 MHz real-time DSP and dual embedded processors for computation, data storage, live video processing, and communication. Software permits users to customize the instrument; set user permissions; generate custom reports; print personalized certificates of analysis; remotely monitor and operate the instrument hands-free from a PC or PDA. Can locate areas of interest on a sample using the integrated color CCD camera and optional integrated 3-mm small-spot collimation.
 
Thermo Fisher Scientific, www.thermofisher.com
 
Pressurex Zero tactile pressure-indicating sensor film characterizes tactile contact surface pressure down to 7.2 psi (0.5 kg/cm2). Is flexible and placed between contacting or mating surfaces to measure and map pressure magnitude and distribution. Variations in contact surface pressure are said to be immediately visible by the impression made on the film; spatial resolution is fine enough to expose minute surface defects and other imperfections. Ranges from 7.2 to 28 psi. Comes as a thin, clear plastic sheet; is available in eight different pressure ranges with highest measuring impact up to 43,200 psi. Changes color directly proportional to the actual pressure applied. Can be scanned through an optical imaging system. Is used in design, manufacture, calibration and quality control. Is said to be ideal for invasive, intolerant environments and tight spaces not accessible to conventional electronic transducers. 
 
Sensor Products Inc., www.sensorprod.com
 
The SC-5000 tabletop ultrasonic stencil and misprint cleaner comes with cleaning head, generator, foot pedal, large tray and 30 foam pads. 
 
The SAWA 5000GUS removes solder balls from stencil apertures after wipe cleaning. A handheld ultrasonic cleaning head is manually applied over apertures with any solvent. The stencil is laid on a foam pad soaked with solvent contained within a large tray. The foam is used to capture solder balls dislodged by the cleaning head. 
 
Seika Machinery Inc., www.seikausa.com  

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