Thermoset MA-511 is a one-component thixotropic epoxy material for use as an adhesive or sealant in microelectronic applications requiring high-speed dispensing. Is said to be a reworkable, low-modulus, non-slumping dispensing adhesive for cap sealing. Cures rapidly, offers adhesion to a variety of plastics; thixotropic rheology permits shape to be maintained after dispensing.
 
Lord Corp., www.lord.com
 

NS-F850 rosin-based flux for lead-free wave soldering ensures wetting and hole fill, and facilitates solder drainage to minimize bridges and icicles. Is said to prevent solder balls from adhering to solder mask. Matte finish facilitates inspection after soldering.

Nihon Superior, www.nihonsuperior.co.jp

FLEXconveyor is a box-build factory on wheels, providing a way to kit and assemble products. Permits unclamping and re-clamping of any section of the conveyor line at any time.
 
Bliss Industries, www.blissindustries.com
 
 

Rehm Pyrolysis is a low-maintenance residue management system deployed within the heating zones of VXP convection reflow ovens. Thermally induces decomposition of organic compounds. Complex molecules are broken down into simpler substances with the use of high temperatures (500°C-900°C) taking place in a largely oxygen free (anaerobic) environment to avoid burning. Remaining residues are then captured within a special granulate. Granulate exchange required at 12-month intervals.
Rehm Thermal Systems, www.rehm-group.com