Circuits Assembly Online Magazine - New Products

New Products

Test protocol 4-wire (Kelvin) is a selectable option in the A6 and A5 flying probe tester models. Places two probes on each pad, assigning a separate current and voltage source. Has eight and 16 head designs. Can be ordered with full PCB automation. A standard four-head probe system reportedly can achieve a max. test speed of 22 test pt./sec. A multi-rail system is said to reach test speeds in excess of 35 - 40 test pt./sec. Can adapt a wide range of test pin types. Needle options include standard Kelvin needle and blade type Kelvin needle. 4-wire measurement achieves a minimal threshold value down to 0.1 mOhm. 4-wire needles can meet the specification value down to 75 µm pad and 150 µm for pitch.

atg Luther & Maelzer GmbH, www.atg-test-systems.de

EP-600 silver-filled electrically conductive two-part epoxy adhesive is for component mounting using dot dispense or screen printing. Is designed to attach components such as resistors, LEDs and grounding wires to metal and plastic substrates where solder or other conductive epoxies requiring high-temperature curing cannot be used. Is said to enable fast build of PTF circuits built on temperature sensitive substrates, such as PET, and for snap curing at low temperatures. Curabe at temperatures of 20º to 140ºC, with cure times ranging from 48 hr. to 2 to 6 min. Snap cure times are possible at higher temperatures. Will cure at room temperature. Once cured, joints on print-treated PET substrates reportedly demonstrate 30 to 40% greater bond strength than other conductive epoxies. Comes in pre-weighed pouches. Is said to reduce dispensing times by up to 70% on high-speed automated dispensers.

Conductive Compounds Inc., www.conductivecompounds.com

The Rhythm EX Selective Soldering System offers a selective soldering range of 24 x 24"; no manual rotation or adjustment is required. Offers closed-loop servo-driven X, Y, and Z-axis motion that articulates the solder wave and flux beneath the PCB. Designed for high-mix or high-volume production. Programmable in minutes to handle basic to complex through-hole soldering. Includes independently heated and programmable Nitrogen inertion and quick-change solder nozzles for keep-away (less than 1.5 mm) and lead protrusion clearance (6 mm). Delivers automation capabilities for wave height management, system standby and startup, automated conveyor width adjustment, dedicated witness vision systems, adjustable temp N₂ DirectHeat and EasyLoad solder pot management.

RPS Automation LLC, www.rpsautomation.com

Automatic Vision Control for L-Series pick-and-place systems is said to advance placement of 0201s; 100% accurate on-the-fly, bottom-up vision placement of micro BGAs and ultra fine pitch QFPs. Cognex Machine Vision has 2 µm resolution scales and easy-to-use software. L-Series is for BGA, µBGA, bottom-leaded and odd-shaped component placement down to 0201 components and 0.015" pitch resolution requirements.

APS Novastar, www.apsgold.com/aps.html

The Unitek Eapro DT-500-PH features a motorized X-axis table, Y-axis table, or X-Y-axis table. Is said to be suited for hot bar bonding multiple parts in an array at one time, bonding multiple flexes onto one PCB, or bonding one flex to both a PCB and LCD. Includes Uniflow2 power supply for selective hot bar soldering, heat sealing and conductive adhesive bonding applications. Reportedly provides targeted heating and precision temperature control for flex circuits, ribbon cables, wires, SMT components, single- or dual-sided edge connectors and thermocompression bonding of gold ribbon.

Miyachi Unitek, www.muc.miyachi.com

PC-controlled Martin “Expert” Pb-free rework station version 9.6 is said to automatically accomplish any stage of SMT repair, from removal to replacement, as well as the re-solder of BGAs, CSPs, µBGAs and other SMDs. A high-res camera combined with auto-vision placement controls component positioning in full and continuous view of the operator. There is no need to shuttle the camera out of the path of the placement head. The IR underheating unit adjusts to exact board size; heats the underside of the PCB and is said to attain Pb-free processing temperatures faster, with no board warpage or component damage. Includes a selection of nozzles for placement, soldering and solder removal, as well as a flux pen and a paste dispensing unit for re-soldering. Includes vacuum pen.

Manncorp, www.manncorp.com