The SP150 printer is a manual or semiautomatic printer with metal or rubber squeegees. Features squeegee lengths of 130 mm, 220 mm, 260 mm, 300 mm or 400 mm. Has an adjustable print pressure force of 4-140 N, programmable printing speeds of 10 to 99 mm/sec, and adjustable separation speed from 1 to 5 mm/s. Print cycle counter records from 0 to 999,999. Has a manual drawer and manual drawer alignment. Reportedly can handle PCBs up to 410 mm x 400 mm, a print table of 460 mm x 520 mm, a maximum printing area of 390 mm x 360 mm, and a substrate height from 1 mm to 4 mm. Provides manual width adjustment, two support bards with lengths of 410 mm, four vacuum fixation pins, 10 support pins, two centering pins with 3 mm diameters, and a Venturi-type vacuum pump. Features XY alignment range of ±3 mm, theta of ±2° and accuracy of ±30 µm. Is said to print maximum frame size of 23" x 23".

Essemtec, www.essemtec.com

The VWP-500 wafer pen is said to accept all of the company’s press-fit wafer tips and an adaptor that accommodates die/SMT handling tips. Available for handling wafer sizes from 2" to 12" in diameter, and for 1/16" ID or 1/8" ID vacuum hoses. Is available as a standalone wafer pen or as a kit with vacuum hose, holder, vacuum source and wafer tip.

Virtual Industries Inc., www.virtual-ii.com

VisualCAM 2006 and GerbTool 15.2 feature version 8.0 ODB++; flip panel; IPC-D-356B support; nearly 200 enhancements and defect fixes; ability to “see through” composite layers, and flying probe test point generation. Choose to export full IPC D-356/A/B (with 099 records for test points) or scaled-back version with test point features only.

Wise Software Solutions Inc., www.wssi.com

Kester 295 No-Clean Flux is free of halides and bromides. Designed for cored solder wire. Tested to conform to IPC-TM-650, IEC61189-2, J-STD-004A and JPCA-ES-01, with no chlorine and bromine detected. Designed with blend of rosin and proprietary activator system. Reportedly eliminates splattering and the need for cleaning. Residues are non-conductive and non-corrosive. Is available in a variety of alloys, wire diameters and flux percentages. Is classified as type ROLO flux. Can be used for both lead and Pb-free soldering. Recommended solder iron tip temperature: 260°C to 370°C for Sn63Pb37 and 350°C to 400°C for Pb-free SnAgCu alloys.

Kester, www.kester.com