WS-Series wafer inspection system performs macro-defect inspection at reported speeds of 115 wafers per hour. Has optional 3-D inspection module, enhanced camera technology, parallel processing and new wafer handling system. Using a high-speed time-delay-integration camera, performs macro defect inspection of unbumped wafers, probe marks, pre- and post-reflow solder bumps, and gold bumps.

RVSI Inspection, www.rvsi.com 

Reel-to-Reel (R2R) precision screen printing enables manufacturers to deposit advanced materials onto flexible substrates directly from the reel. Is said to be able to print onto substrates typically up to 150 m in length and 500 mm wide. Is said to be ideal for use with flexible printed circuits, organic LED substrates, non-conductive materials, fuel cell membranes and a wide range of foils, papers and composites. Applications range from rope lights and lighting systems to automotive instruments, mobile phones, RFID tag technologies and laptop PCs. Reportedly replaces the conventional transport system used to drive boards in and out of the print area with three vacuum beds and a clamping system.

DEK, www.dek.com