Friendly Green presaturated wipes are low linting and designed
to remove all solder pastes, resins, water-soluble, no-clean, leaded and Pb-free
from stencils, screens, misprints and other surfaces. Are said to be
effective in cutting through tough, dried solder paste and flux residue. Do not
harm stencil construction materials (aluminum frame, stainless steel or
polyester screen and stainless steel, brass or nickel metal etched foil). Are
saturated with low-toxicity compounds, contain no solvents, and are
biodegradable. Meet or exceed current and reasonably anticipated VOC
requirements (EPA, AQMD, SCAQMD).
The Flexys-10 intelligent placement system is for low- to medium-volume high-mix production and NPI requirements. Rated at 10,000 cph (IPC-9850: 8,600 cph). Comes with eight new turret positions, an eight-position rotary head with on-the-fly vision. Feeder capacity of 128 x 8 mm tapes and 10 matrix tray locations. Places 0201 to 2.75" sq QFP/BGA. Has a reported accuracy of 0.0014" for QFP/BGA and 0.0035" for chips at 3-Sigma. Accommodates tape, stick or tray feeder types. Options include standalone or in-line conveyors, intelligent belt feeders, barcode reader, glue dispenser, fixed upward vision camera, component test verification and more.
The EL thermal imaging system includes a new camera with a 320
x 240 uncooled detector array with <0.05ËšC sensitivity and 16-bit digital camera
link interface. Said to capture and display images at a rate of 30
frames/sec. and provide a resolution of 70 µm.
For use in locating shorts, stressed components and other
defects, and analyzing thermal behavior of individual components. Model
Board Comparison locates defects by comparing thermal behavior of defective
boards to a known good board model.
Design For Manufacture (DfM) Add-On for Altium Designer is free and factory-certified. Implements Sunstone’s manufacturing capabilities interactively inside Altium Designer. Is said to reduce costs by reducing design errors; reduced time by using existing rule decks instead of user-created versions; and simplify design processes by following a factory-certified rule deck.
VarioTap in-system emulation technology integrates JTAG emulation and boundary scan test for real interlaced test operations and multivalent flash
in-system programming. Supports in principle all JTAG/IEEE1149.1 compliant µProcessor
or µController, independent of scan chain configuration, up to multi-processor or multi-core applications. Adaptive streaming technology reportedly executes emulation tests in a test program parallel or interactively to boundary scan tests.
Flexible silicone conformal coating is said to meet IEC 61086-2. Said be fast drying and has passed all coatings tests for assembled PCBs including thermal aging, flexibility, damp heat and salt mist. Visual inspection using ultraviolet light revealed no voids, holes or delamination on samples, and no loss of adhesion or discoloration of copper conductors. A tackiness test reportedly revealed that when a 500g load is applied for 1 min., it remains non-tacky. Has operating temperature ranging from -50Ëš to 125ËšC; is touch dry at 20ËšC in 10 to 15 min. Available in 400 ml aerosol and 5 liter bulk container. Contains no isocyanates. Meets V-1 level of the UL approval.