KIC Vision is now available with additional automatic capabilities. Is said to automatically measure a product’s thermal profile as frequently as once an hour. Can shut down the feed conveyor when the measured profile is no longer in spec. The optional SPC package automatically logs basic SPC charts, including Cpk, every time a new profile is measured. Will warn when the next profile’s Cpk level has dropped below the user selected level. Both the alarming and SPC functions can trigger a light tower to alert a technician of a problem. Data collected can be output automatically to an external file for further data management.
The Slot-Lok circuit board shielding design and manufacturing process uses standardized manufacturing methods. Shields are made from RoHS-compliant materials said to be effective for soldering, corrosion resistance and shielding. Has an audible click that confirms secure retention of the CBS cover.
Permalex Paste Manager self-cleaning squeegee has a powerful, motorized, compact assembly and reportedly reduces solder paste adhesion by 90%. A small shuttle blade reciprocates along the front face of the main metal squeegee and cuts away solder paste attached to the squeegee. Can be dropped into a wide selection of inline and batch SMT printers.
BC-60 and BC-100 conveyors have 3-mm wide ESD edge belts and handle PCBs up to 18" wide. Features include variable speed control, front ESD work surface with grounding strap (green or royal blue mats available), Inspect and Pass mode selection with hand and foot pedal for PCB release, and PLC. BC 60 is 600 mm long with a single drive; BC 100 comes with single 1M drive or two 500 mm drives.
Siplace X4i reportedly has a placement speed of more than 100,000 cph. Comes standard with a flexible dual-lane conveyor and four 20-nozzle heads. In dual-lane mode, it is said to achieve placement of 110,000 cph for board sizes up to 250 mm x 380 mm. Larger boards up to 436 mm x 380 mm can be processed when running in single conveyor mode. Has a footprint of 8 ft². Is designed to shorten gantry travel distance between feeders and board. A productivity lane enables parallel mode.
This solder delivery and inert atmosphere control system features a
flow monitor that uses nitrogen pressure levels to indicate the level of solder
in the solder pot, and a heated nitrogen path. Is said to provide accurate
solder pot capacity information. Replaces mechanical probes. Has a method to
‘super-heat’ the nitrogen supply. Reportedly enhances flowed solder
performance.