HLX8100 is a placement system featuring a feeder capacity of 192 x 8 mm and programmable feeders. Can accommodate speeds up to 11,250 cph. Is designed for high-mix/high-speed production. Linear drives are said to be maintenance-free. During placement, the board is fixed. Uses collect and place method. Comes equipped with one placement head with four vacuum nozzles. Cognex Vision enables alignment and checking of components. The alternative HLX8200 model features two heads and accommodate speeds up to 22,000 cph.
 

SP003-MLV semi-automatic stencil printer features trans-stencil vision. Offers motorized print head and vertical stencil separation. Can accommodate stencils or screens up to 23 x 23". Is available with different print mounts. Is said to be ideal for small- and medium-volume production. Can print a maximum of 400 x 410 mm, features two cameras and is 700 x 800 x 500 mm (without the optional substructure).

 Essemtec, www.essemtec.com

One-Step Underfill 688 is a non-odorous, low surface tension, reworkable one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and µBGA assemblies. Acts as a flux and an underfill. May be applied directly after the SMT printing process and cured during the standard Pb-free reflow process. Can be used in mixed alloy solutions, such as Pb-free BGA on a tin lead board. Is said to offer reliability through high Tg, low CTE, and good fill with no voiding. Is compatible with no-clean flux residues. May be reworked at 120°C. Viscosity reportedly remains stable throughout shelf life. Wets to OSP, ENIG, immersion silver and immersion tin board surfaces.
 
AIM, www.aimsolder.com