Circuits Assembly Online Magazine - New Products

New Products

EnviroMark 923 is a halogen-free, Pb-free and no-clean paste. Is said to have excellent wetting, low voiding and soft pin probeable residues. Reportedly has consistent solder paste volume deposits regardless of idle time, stencil life and print speed. Offers 0201 print and reflow capabilities with standard Type 3 powder. Capable up to 200 mm/sec print speed and bridge resistant.

Kester Inc., www.kester.com

EnviroMark 828 is a Pb-free water-soluble paste with ultra low BGA voiding. Is said to create no foam in inline washers and has excellent solderability. Has non-slumping chemistry.

Kester Inc., www.kester.com

The DXBG bench dispenser is for two-component reactive resins of a variety of ratios. Permits A and B components of flowable adhesives to be gravity-fed from separate, refillable two-gal. containers. Components are forced by metering rods directly into a disposable static mixer. Comes with a foot pedal actuator. Permits hands-free operation. Stand is adjustable over three axes.

Mixpac Equipment Inc., www.mixpacequipment.com

MPM 125 screen printer is for low-to-medium volume applications. Reportedly features ±12.5 µm accuracy at Six-Sigma, with Cpk ≥ 2.0. Includes CANOpen motion control architecture, benchmarking software and Windows XP, and setup Wizards for ease of use.

Speedline Technologies, www.speedlinetech.com

High retention Type A and B USB interfaces (USBR Series) are said to comply with the Class 1, DIV II minimum withdrawal requirement of 15 Newtons. These connectors have an orange color-coded insulator to differentiate them from standard withdrawal force connectors. Are available in surface mount and through-hole designs with a choice of standard right angle or vertical top-entry orientation.

Samtec, www.samtec.com

A scaled-down version of the MK-II, the Advantage 16e, was designed to counteract any penetration by smaller knockoffs of the MK-II in Asia. Is said to be stripped down for buyers looking for lower cost system. Is about ¼ the size of MK-II and includes fewer operational controls, including recordkeeping. Includes vacuum pump, booster blower and unitary chassis design. Includes 16 level, horizontal planar electrode configuration (24" W x 18" D x 1.25" spacing), 1,000W 13.56 MHz solid state air-cooled R.F. generator, process temperature control, two mass-flow meters with precision needle valve, automatic nitrogen purging and touch-screen interface.

Plasma Etch Inc., www.plasmaetch.com