TempSave soldering materials address reduction of peak reflow temp. to reduce defects contributing to package warpage, reduce energy consumption during reflow, and avoid potential damage to temperature-sensitive devices.
W20 water-soluble solder paste is a zero-halide/halogen flux formula engineered for enhanced wetting performance on all solderable electronic surfaces.
XQuik II Plus component counting system has cycle time less than 20 sec. for both single reel and quad counts.
FH63S series shielded flexible printed circuit connector has patented single-action flip lock technology.