New Products
IHXL-1500VZ-51 through-hole inductor delivers 420A saturation current for 30% inductance reduction in 1500 case size.
HiTech CU21-3240 and CU31-2030 are one-component capillary underfills designed to protect assembled chip packages on printed circuit boards.
High-precision TR77000QM SII 3-D AOI has 5.5µm high-res 12mp imaging technology for semiconductor and packaging industry and other industries.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager