New Products
SMT 158D8 high thermal conductive underfill is a diamond-filled, reworkable liquid epoxy. Has thermal conductivity of >6W/mK, high salt-moisture resistance, and excellent adhesion.
W series embedded Wi-Fi antennas offer range of standard solutions with ultraminiature form factors, PCB or FPC antenna technologies capable of supporting single- and dual-band operating frequencies up to 6GHz, performance-enhancing foam coatings, and various mounting options.
R&S NRP67S and R&S NRP67SN three-path diode power sensors have max. measurable frequency of 67GHz.
SC-BP3 multi-purpose bubbling cleaning system reportedly cleans flux five times faster than immersion cleaning.
CW-232 flux-cored wire combines wetting speed and spread with low-spatter performance.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association