New Products
Palomar 8100 automated, thermosonic high-speed ball-and-stitch wire bonder performs ball bumping and customized looping profiles.
VEMD4010X01 and VEMD4110X01 surface-mount automotive-grade silicon PIN photodiodes come in 0805 case size with 0.7mm profile.
APC Series surface mount resistors have been qualified for use in environments exposed to sulphur-bearing gasses.
Four new models of AR series environmental stress chambers for rapid-rate temperature cycling provide temp. cycling and humidity performance needed to validate quality and reliability for automotive, electronics and other products.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager