New Products
EO-MC-001 liquid flux can be mixed with water or alcohol and can be used for tinning process in electronics industry and mechanical engineering.
EA1400 XRF uses detection technology coupled with x-ray optics designed for rapid screening of RoHS substances.
EZReball 6,000 ball count BGA preforms consist of 4,000 solder balls on a 0.4mm pitch over a 45mm x 45mm package.
CX90B series top-mount USB 2.0 Type-C connector has 16 contacts. Is reportedly ideal for applications susceptible to high-vibration and drop impacts, including control systems, drones, medical devices, smart meters, point-of-sale equipment, imaging equipment and other small portable devices.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager