PF606-P269J lead-free jetting solder paste is designed for jetting processes.

Offers workability and solderability for automatic high-speed jetting production with accuracy and precision. Is halogen-free (ROL0) and complies with RoHS 2.0 and REACH. Is formulated with SAC 305 alloy and powder size ranges from type 4 to type 7 for fine dot jetting. Is suitable for fine pitch and ultra-fine pitch applications and devices with uneven, cavities and other difficult to print locations. Dot volume, size and shape can be adjusted and optimized for each individual component and pad on the board by using the jetting system, making it applicable for fine-pitch devices and also minimizing the failure rate in production.


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