Delta 769LF is a zero-halogen, water-soluble solder paste for nitrogen and air reflow applications.

Is designed specifically for high-melting temperature lead-free alloys, such as SAC 305 and Sn96.5/Ag3.5. Provides fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere. Provides consistent print performance at wide humidity levels, solderability, and promotes cleaning performance to yield bright, shiny solder joints. Is a stable water-soluble formulation that provides consistent tack time, stencil life and print definition. Is classified as ORH0 flux under IPC-J-STD-004C.


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